Global 3D IC and TSV Interconnect Market is expected to reach $6.55 billion by 2016

INTRODUCTION:

3D IC or 3-Dimensional Integrated Circuit is a term in electronics used for a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor industry is hotly pursuing this emerging technology in many different forms; thus the full definition is still somewhat fluid. In a 3D IC package two or more chips (ICs) are stacked vertically so that they occupy less space and/or have greater connectivity. There are 4 manufacturing technologies for 3D IC namely, Monolithic, Wafer-on-Wafer, Die-on-Wafer, and Die-on-Die method.

CURRENT SCENARIO OF 3D IC MARKET:

The significant growth of the 3D IC market is attributed to accelerated demand for higher bandwidths, reduced power consumption, and higher density. High efficiency of the solution and the guaranteed return on investment (ROI) has made 3D IC technology plus its integration with through silicon vias (TSVs) significant commercial strides in the past 2 years. There are some challenges too as this technology is new it is poised to face some new challenges like Design complexity, TSV-introduced overhead, Testing, Lack of standards, Heterogeneous integration supply chain, and Lack of clearly defined ownership. Memories and sensors are expected to provide the largest market owing to improvements in design that can be achieved in 3D ICs.

BENEFITS OF 3D ICs:

Footprint - More functionality in a smaller space. Moore’s Law is extended.

Cost effective.

Increased Bandwidth – The stack up arrangement allows a bus much wider than the typical 128 or 256 bits alleviating the memory wall problem.

Heterogeneous integration – The concept of putting different functionality in different layers provides heterogeneous integration of different processes.

Shorter interconnect - Average wire length is reduced.

Power – Reduced power consumption by 15-100 times. Less parasitic capacitance, less heat generation, extended battery life, and lower cost of operation.

Design - Higher order of connectivity and vertical design offers new design possibilities.

Circuit security – Reverse engineering of the circuitry is quite complicated hence providing a certain level of security.

FUTURE PROSPECTS OF 3D IC MARKET:

According to new market research report by MarketsandMarkets, the total 3D IC market is expected to reach $6.55 billion by 2016 at a CAGR of 16.9% from 2011 to 2016. Asia is leading the 3D IC market and has the highest growth rate. This is mainly because a huge number of semiconductor companies such as Samsung (South Korea), United Microelectronics Corporation (Taiwan), Taiwan Semiconductor Manufacturing Company Limited (Taiwan), and more boosting the 3D IC manufacturing in a cost effective manner. In terms of revenue generation too, Asia holds the highest share of around 40%, followed by North America with 35%. In the near future, it is expected that newer applications such as hybrid memory, graphics processor unit, low density parity check decoder, and cell broadband engine will emerge and serve as potential markets for 3D ICs and TSV interconnects. This new 3D IC/Chip Market and TSV Interconnect Market research report categorizes the 3D IC market on the basis of manufacturing approaches, usage in different end-products, applications and geographical analysis; forecasting revenue and analyzing trends.

The report can be referred here:
http://www.sbwire.com/press-releases/3d-ic-and-tsv-interconnect-market-worth-655-billion-by-2016-at-a-cagr-of-169-382301.htm